STULZ - Your Partner for Integrated Liquid Cooling Infrastructures
The increasing use of high-performance computers is presenting cooling infrastructure with new challenges. The efficient and reliable management of extremely high heat loads is of major importance. Consequently, the demand for innovative cooling solutions is on the rise, with liquid cooling (LC) emerging as a particularly promising option. STULZ stands as your global partner, offering cutting-edge solutions to tackle these challenges and ensure future-proof cooling infrastructure.
Liquid Cooling Technologies
Direct Chip Liquid Cooling (DCLC)
- Central to this technology is the strategic placement of cold plates directly above heat sources, particularly the processors in server units.
- The close proximity ensures rapid and precise heat transfer, thereby optimizing cooling efficiency.
- The cooling process is facilitated by a networks of small tubes that guide a liquid coolant directly to the processors.
- Once absorbed by the liquid coolant, the heat is swiftly carried away and circulated through coolant distribution units to a re-cooler.
- The heat is released into the surrounding environment, completing the cooling cycle.
- While liquid cooling serves as the foundation of the system, a complementary air-cooling component remains essential. Approximately 20-30% of the cooling requirement is fulfilled through air-cooling mechanisms, ensuring comprehensive thermal management.
