Immersion Cooling
STULZ - your partner for integrated liquid cooling infrastructures
The increasing use of high-performance computers is presenting cooling infrastructure with new challenges. The efficient and reliable management of extremely high heat loads is of major importance. Consequently, the demand for innovative cooling solutions is on the rise, with liquid cooling (LC) emerging as a particularly promising option. STULZ stands as your global partner, offering cutting-edge solutions to tackle these challenges and ensure future-proof cooling infrastructure.
Why Liquid Cooling?
Liquid cooling technologies
Immersion Cooling
Immersion Cooling entails submerging IT equipment, such as servers, entirely into a non-conductive liquid. Typically, this liquid is contained within an insulated tank, ensuring efficient heat dissipation. Heat generated by the submerged equipment is absorbed by the liquid. To maintain optimal operating temperatures, the heated liquid is then cooled using either an external or internal heat exchanger, which is in turn connected to a re-cooler. Even with this technology, a supplementary air cooling component remains indispensable. Approximately 5% of the heat load are covered by air-cooled systems.
Direct Chip Liquid Cooling (DCLC)
Central to this technology is the strategic placement of cold plates directly above heat sources, particularly the processors in server units. This close proximity ensures rapid and precise heat transfer, thereby optimizing cooling efficiency. The cooling process is facilitated by a networks of small tubes that guide a liquid coolant directly to the processors. Once absorbed by the liquid coolant, the heat is swiftly carried away and circulated through coolant distribution units to a re-cooler. Here, the heat is released into the surrounding environment, completing the cooling cycle. While liquid cooling serves as the foundation of the system, a complementary air-cooling component remains essential. Approximately 20-30% of the cooling requirement is fulfilled through air-cooling mechanisms, ensuring comprehensive thermal management.
Infrastructure
By isolating the Technology Cooling System (TCS) and Facilities Water System (FWS), the risk of cross-contamination and leaks is significantly reduced, thereby enhancing the overall reliability of the cooling system.
STULZ Products for Direct Chip Liquid Cooling
The STULZ Coolant Distribution Unit CyberCool CMU is a central component in both direct liquid-to-chip cooling and immersion cooling solutions to maximize heat exchange within a limited footprint. This unit completely isolates the facility water system (FWS) and technology cooling system (TCS) sides of the liquid cooling system and accurately controls the supply temperature and flow rate of the coolant while consuming minimal power.
